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10AX115N3F45E2SG - Intel

Description: IC FPGA 768 I/O 1932FCBGA

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PCB Footprints
10AX115N3F45E2SG - Intel PCB footprint - BGA - BGA - 1932-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.50
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3D Models
10AX115N3F45E2SG - Intel  - 3D model - BGA - 1932-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.50
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10AX115N3F45E2SG Details

  • Manufacturer Part Number:

    10AX115N3F45E2SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1932

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1932

  • Length:

    45 mm

  • Number of CLBs:

    42720

  • Number of Inputs:

    768

  • Number of Logic Cells:

    1150000

  • Number of Outputs:

    768

  • Number of Terminals:

    1932

  • Operating Temperature-Max:

    100 °C

  • Organization:

    42720 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1932,44X44,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    45 mm

10AX115N3F45E2SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX115N3F45E2SG FPGA is approximately 12W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's guidelines for clock domain crossing and clock signal routing.
  • To optimize your design, use Intel's Quartus Prime software to analyze and optimize your design. This includes using the 'Optimize For' feature, which allows you to target specific design goals such as area, speed, or power. Additionally, consider using Intel's IP cores and optimized design examples to reduce area and improve performance.
  • To ensure reliable data transfer between different clock domains, use Intel's recommended clock domain crossing (CDC) techniques, such as using synchronizers, FIFOs, or asynchronous FIFOs. Additionally, consider using Intel's CDC IP cores, which provide pre-validated and optimized CDC solutions.
  • To ensure proper thermal management and heat dissipation, follow Intel's guidelines for thermal design, including using a heat sink, thermal interface material, and a well-designed PCB. Additionally, consider using Intel's thermal analysis tools to simulate and optimize your design's thermal performance.

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10AX115N3F45E2SG Overview

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