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10AX115R3F40I2LG - Intel

Description: FPGA Arria® 10 GX Family 1150000 Cells 20nm Technology 0.9V Medical 1517-Pin FC-FBGA

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PCB Footprints
10AX115R3F40I2LG - Intel PCB footprint - BGA - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX115R3F40I2LG - Intel  - 3D model - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.35
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10AX115R3F40I2LG Details

  • Manufacturer Part Number:

    10AX115R3F40I2LG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1517

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1517

  • Length:

    40 mm

  • Number of CLBs:

    42720

  • Number of Inputs:

    342

  • Number of Logic Cells:

    1150000

  • Number of Outputs:

    342

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    42720 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    40 mm

10AX115R3F40I2LG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX115R3F40I2LG FPGA is approximately 12W, depending on the operating frequency and usage.
  • The 10AX115R3F40I2LG FPGA supports DDR3 memory interface through its external memory interface (EMIF) IP core. You can use Intel's Quartus II software to implement the DDR3 interface and configure the EMIF IP core.
  • Yes, the 10AX115R3F40I2LG FPGA supports high-speed serial interfaces like PCIe and SATA through its transceiver tiles. You can use Intel's IP cores for PCIe and SATA to implement these interfaces.
  • To optimize the FPGA design for power consumption, use Intel's PowerPlay power analysis tool to identify power-hungry components and optimize the design accordingly. You can also use power-saving features like clock gating and dynamic voltage and frequency scaling.
  • The maximum operating frequency of the 10AX115R3F40I2LG FPGA is approximately 500 MHz, depending on the device speed grade and operating conditions.

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10AX115R3F40I2LG Overview

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