Part Image

10CL006YU256A7G - Intel

Description: Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 176 276480 6272 256-LFBGA

Download 10CL006YU256A7G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
10CL006YU256A7G - Intel PCB footprint - BGA - BGA - 256-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
click to zoom
3D Models
10CL006YU256A7G - Intel  - 3D model - BGA - 256-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
click to zoom

10CL006YU256A7G Details

  • Manufacturer Part Number:

    10CL006YU256A7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    UBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    14 mm

  • Number of CLBs:

    392

  • Number of Inputs:

    176

  • Number of Outputs:

    176

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    392 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    14 mm

10CL006YU256A7G Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the 10CL006YU256A7G, which recommends a 4-6 layer stackup with a minimum of 2 mil trace width and 2 mil spacing. Additionally, Intel suggests using a high-speed PCB material with a dielectric constant of 3.5-4.5.
  • Intel recommends a power supply design with multiple voltage rails, including 1.0V, 1.2V, and 3.3V. The power supply should be able to provide a minimum of 10A of current, and Intel suggests using a high-quality, low-ESR capacitor for decoupling.
  • The 10CL006YU256A7G has an industrial temperature range of -40°C to 100°C, but Intel recommends operating the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • Intel recommends using a reliable configuration interface, such as JTAG or PCIe, and following the recommended configuration and programming procedures outlined in the Intel Quartus Prime software documentation.
  • Intel recommends following high-speed design practices, such as using differential signaling, controlling impedance, and minimizing signal reflections. Additionally, Intel suggests using the Intel Quartus Prime software to analyze and optimize signal integrity.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

10CL006YU256A7G Overview

Use the download button to access the 10CL006YU256A7G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 10CL0, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 10CL006YU256A7G

Showing 0 results