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10CL010YU256A7G - Intel

Description: FPGA Cyclone 10 LP Family 10k Cells 60nm Technology 256 Pin UBGA Standard Voltage

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10CL010YU256A7G - Intel PCB footprint - BGA - BGA - 256-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
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10CL010YU256A7G - Intel  - 3D model - BGA - 256-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50
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10CL010YU256A7G Details

  • Manufacturer Part Number:

    10CL010YU256A7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    UBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    14 mm

  • Number of CLBs:

    645

  • Number of Inputs:

    176

  • Number of Outputs:

    176

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    645 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    14 mm

10CL010YU256A7G Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the 10CL010YU256A7G FPGA, which includes recommendations for PCB layout, stackup, and signal routing to ensure optimal signal integrity. The guide can be found on Intel's website.
  • Intel recommends using a power management IC (PMIC) specifically designed for the 10CL010YU256A7G FPGA, such as the Intel Enpirion Power Management IC. The PMIC provides a single-chip solution for power sequencing and voltage regulation, and is optimized for the FPGA's power requirements.
  • The 10CL010YU256A7G FPGA has a maximum junction temperature of 100°C. Intel recommends using a heat sink or thermal interface material to ensure proper thermal management. The FPGA's thermal design guide provides more detailed information on thermal management requirements.
  • The 10CL010YU256A7G FPGA's clocking and PLLs can be configured using Intel's Quartus Prime software. The software provides a graphical user interface for configuring clock domains, PLLs, and clock routing. Intel also provides documentation and application notes on clocking and PLL configuration.
  • The 10CL010YU256A7G FPGA has several security features, including bitstream encryption, authentication, and secure boot. Intel provides documentation and application notes on implementing these security features, as well as a security development kit (SDK) for developing secure FPGA applications.

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10CL010YU256A7G Overview

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