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10CL010ZU256I8G - Intel

Description: FPGA Cyclone® 10 LP Family 10320 Cells 256-Pin UFBGA

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PCB Footprints
10CL010ZU256I8G - Intel PCB footprint - BGA - BGA - UBGA256
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10CL010ZU256I8G - Intel  - 3D model - BGA - UBGA256
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10CL010ZU256I8G Details

  • Manufacturer Part Number:

    10CL010ZU256I8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    UBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9

  • Additional Feature:

    -40 TO 125 TEMPERATURE RANGE IS AVAILABLE AS EXTENDED INDUSTRIAL

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    14 mm

  • Number of CLBs:

    645

  • Number of Inputs:

    176

  • Number of Logic Cells:

    10320

  • Number of Outputs:

    176

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    645 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    14 mm

10CL010ZU256I8G Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10CL010ZU256I8G is approximately 2.5W, but this can vary depending on the specific design and operating conditions.
  • The 10CL010ZU256I8G is rated for commercial temperature range (0°C to 85°C), but it can be used in industrial temperature range (-40°C to 100°C) with some derating. However, it's not recommended for extreme temperature environments without proper thermal management and design considerations.
  • To ensure signal integrity on the high-speed interfaces, it's essential to follow Intel's guidelines for PCB design, layout, and routing. This includes using controlled impedance traces, minimizing signal reflections, and using termination resistors as needed.
  • The 10CL010ZU256I8G is not a radiation-hardened device, and it's not suitable for use in high-radiation environments without additional protection and design considerations. For radiation-hardened applications, Intel offers specific FPGA families, such as the RTG4 and RTAX families.
  • Intel provides various security features in the 10CL010ZU256I8G, including AES encryption, secure boot, and anti-tamper protection. To secure the device, it's essential to use these features, implement secure design practices, and follow Intel's guidelines for secure FPGA development.

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10CL010ZU256I8G Overview

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