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10CL055YF484I7G - Intel

Description: FPGA - Field Programmable Gate Array

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10CL055YF484I7G - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00_1
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10CL055YF484I7G - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00_1
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10CL055YF484I7G Details

  • Manufacturer Part Number:

    10CL055YF484I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.1

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of CLBs:

    3491

  • Number of Inputs:

    321

  • Number of Logic Cells:

    55856

  • Number of Outputs:

    321

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3491 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

10CL055YF484I7G Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10CL055YF484I7G FPGA is approximately 2.5W, depending on the operating frequency and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
  • To optimize your design for area and performance, use the Intel Quartus Prime software to analyze and optimize your design. This includes using the Design Space Explorer (DSE) to explore different design implementations, and the Performance Analyzer to identify performance bottlenecks.
  • To ensure reliable data transfer between the FPGA and external memory, use a robust memory interface protocol such as DDR3 or DDR4, and implement error correction mechanisms such as ECC or CRC. Additionally, follow the guidelines outlined in the Intel FPGA External Memory Interface Handbook.
  • The 10CL055YF484I7G FPGA has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement a thermal management strategy that includes heat sinks, thermal interfaces, and airflow management. Refer to the Intel FPGA Thermal Management Guidelines for more information.

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