Part Image

10CL120YF780I7G - Intel

Description: Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 525 3981312 119088 780-BGA

Download 10CL120YF780I7G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
10CL120YF780I7G - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
click to zoom
3D Models
10CL120YF780I7G - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
click to zoom

10CL120YF780I7G Details

  • Manufacturer Part Number:

    10CL120YF780I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    7443

  • Number of Inputs:

    525

  • Number of Outputs:

    525

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7443 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10CL120YF780I7G Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10CL120YF780I7G FPGA is approximately 12W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's guidelines for clock domain crossing and clock signal routing.
  • To optimize your design for area and performance, use Intel's Quartus Prime software to analyze and optimize your design. This includes using the 'Optimize For' feature, which allows you to target specific design goals such as area, speed, or power consumption.
  • To ensure signal integrity, follow Intel's guidelines for signal routing, including using differential signaling, minimizing signal length, and avoiding signal crosstalk. Additionally, use Intel's signal integrity analysis tools to identify and mitigate potential signal integrity issues.
  • The recommended design flow for implementing a design on the 10CL120YF780I7G FPGA includes: 1) design entry using HDL or RTL, 2) synthesis using Intel's Quartus Prime software, 3) placement and routing, 4) timing analysis and optimization, and 5) device programming and verification.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

10CL120YF780I7G Overview

Use the download button to access the 10CL120YF780I7G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 10CL1, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 10CL120YF780I7G

Showing 0 results