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10CX085YF672I5G - Intel

Description: FPGA Cyclone® 10 GX Family 85000 Cells 20nm Technology 672-Pin FBGA Tray

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10CX085YF672I5G - Intel PCB footprint - BGA - BGA - 672 bega
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10CX085YF672I5G - Intel  - 3D model - BGA - 672 bega
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10CX085YF672I5G Details

  • Manufacturer Part Number:

    10CX085YF672I5G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    27 mm

  • Number of CLBs:

    31000

  • Number of Inputs:

    216

  • Number of Logic Cells:

    85000

  • Number of Outputs:

    216

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    31000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

10CX085YF672I5G Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10CX085YF672I5G FPGA is approximately 12W, depending on the operating frequency and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
  • To optimize your design for area and speed, use the Intel Quartus Prime software to analyze and optimize your design. Apply pipelining, retiming, and other optimization techniques to reduce area and increase speed. Additionally, consider using Intel's IP cores and optimized IP functions to reduce area and improve performance.
  • To ensure signal integrity in your high-speed design, use the Intel Quartus Prime software to analyze and optimize your design for signal integrity. Apply techniques such as differential signaling, shielding, and termination to minimize signal degradation. Additionally, consider using Intel's high-speed serial interface IP cores, which are optimized for signal integrity.
  • For optimal performance and signal integrity, Intel recommends following the PCB layout and routing guidelines outlined in the Intel FPGA PCB Design Guidelines document. This includes using a multi-layer PCB, separating analog and digital signals, and minimizing signal lengths and vias.

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