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- Part Number 10CX085YU484E6G
- Manufacturer Intel
- Pin Count 484
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Flip Chip – Channel Lid - A: 3.25
- Released Date Sep 19, 2018
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
10CX085YU484E6G Details
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Manufacturer Part Number:
10CX085YU484E6G
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Rohs Code:
Yes
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Part Life Cycle Code:
Transferred
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Package Description:
UBGA-484
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Country Of Origin:
Mainland China, Malaysia, Taiwan, USA, Vietnam
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.01
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Manufacturer:
Intel Corporation
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YTEOL:
9.8
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JESD-30 Code:
S-PBGA-B484
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Length:
19 mm
10CX085YU484E6G Frequently Asked Questions (FAQs)
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The maximum power consumption of the 10CX085YU484E6G FPGA is approximately 12W, depending on the operating frequency and usage.
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Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
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To optimize your design for area and speed, use the Intel Quartus Prime software to analyze and optimize your design. This includes using the Design Space Explorer (DSE) to explore different design implementations, and the Hyper-Availability feature to optimize for area and speed.
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To ensure reliable data transfer between the FPGA and external memory, use the Intel FPGA's built-in memory controllers, such as the DDR3/DDR4 SDRAM controller, and follow the guidelines outlined in the Intel FPGA Memory Interface User Guide.
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The 10CX085YU484E6G FPGA has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management, as outlined in the Intel FPGA Thermal Management User Guide.
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10CX085YU484E6G Overview
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