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10CX105YF672E6G - Intel

Description: Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 236 8641536 104000 672-BBGA, FCBGA

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PCB Footprints
10CX105YF672E6G - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10CX105YF672E6G - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10CX105YF672E6G Details

  • Manufacturer Part Number:

    10CX105YF672E6G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    27 mm

  • Number of CLBs:

    38000

  • Number of Inputs:

    236

  • Number of Logic Cells:

    104000

  • Number of Outputs:

    236

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Organization:

    38000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

10CX105YF672E6G Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10CX105YF672E6G FPGA is approximately 12W, depending on the operating frequency and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
  • To optimize your design for area and speed, use the Intel Quartus Prime software to analyze and optimize your design. This includes using the Design Space Explorer (DSE) to explore different design implementations, and the Hyper-Accelerated Parallel Synthesis (HAPS) feature to accelerate synthesis and fitting.
  • To ensure signal integrity in your high-speed design, use the Intel Quartus Prime software to analyze and optimize your design for signal integrity. This includes using the Signal Integrity Tool to analyze signal integrity issues, and the Board Trace Modeler to model and analyze board-level signal integrity.
  • Intel recommends following the PCB design guidelines outlined in the Intel FPGA PCB Design Guidelines document, which includes guidelines for PCB layout, signal routing, and decoupling capacitors.

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