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10CX105YF780E6G - Intel

Description: FPGA - Field Programmable Gate Array

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PCB Footprints
10CX105YF780E6G - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10CX105YF780E6G - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10CX105YF780E6G Details

  • Manufacturer Part Number:

    10CX105YF780E6G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    38000

  • Number of Inputs:

    284

  • Number of Logic Cells:

    104000

  • Number of Outputs:

    284

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Organization:

    38000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10CX105YF780E6G Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10CX105YF780E6G FPGA is approximately 12W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's guidelines for clock domain crossing and clock signal routing.
  • To optimize your design for area and speed, use Intel's Quartus Prime software to synthesize and implement your design. Additionally, consider using design techniques such as pipelining, retiming, and resource sharing to minimize area and maximize speed.
  • To ensure signal integrity, follow Intel's guidelines for signal routing, termination, and buffering. Additionally, use Intel's signal integrity analysis tools to identify and mitigate signal integrity issues in your design.
  • To ensure reliable operation of the high-speed transceivers, follow Intel's guidelines for transceiver usage, including proper signal termination, routing, and clocking. Additionally, use Intel's transceiver wizard to configure and optimize transceiver settings.

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10CX105YF780E6G Overview

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