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10CX105YU484E6G - Intel

Description: FPGA Cyclone® 10 GX Family 104000 Cells 20nm Technology 484-Pin UBGA Tray

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PCB Footprints
10CX105YU484E6G - Intel PCB footprint - BGA - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Flip Chip – Channel Lid - A: 3.25
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3D Models
10CX105YU484E6G - Intel  - 3D model - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Flip Chip – Channel Lid - A: 3.25
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10CX105YU484E6G Details

  • Manufacturer Part Number:

    10CX105YU484E6G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    UBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Number of CLBs:

    38000

  • Number of Inputs:

    188

  • Number of Logic Cells:

    104000

  • Number of Outputs:

    188

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Organization:

    38000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.05 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

10CX105YU484E6G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10CX105YU484E6G is -40°C to 100°C.
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Intel provides a PCB layout and routing guide for the 10CX105YU484E6G, which recommends using a 4-layer PCB with a dedicated power plane, and following specific routing guidelines for high-speed signals.
  • To optimize power consumption, use the Intel Quartus Prime software to enable power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, consider using a low-power FPGA configuration and optimizing the design for low-power operation.
  • Intel recommends using 0.1 μF and 10 μF decoupling capacitors, placed as close as possible to the FPGA's power pins, with a maximum distance of 1 inch. The capacitors should be placed on the same layer as the FPGA, and connected to the power pins using vias.

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