Part Image

10CX105YU484I6G - Intel

Description: FPGA - Field Programmable Gate Array

Download 10CX105YU484I6G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
10CX105YU484I6G - Intel PCB footprint - BGA - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Flip Chip – Channel Lid - A: 3.25
click to zoom
3D Models
10CX105YU484I6G - Intel  - 3D model - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Flip Chip – Channel Lid - A: 3.25
click to zoom

10CX105YU484I6G Details

  • Manufacturer Part Number:

    10CX105YU484I6G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    UBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Number of CLBs:

    38000

  • Number of Inputs:

    188

  • Number of Logic Cells:

    104000

  • Number of Outputs:

    188

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    38000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.05 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

10CX105YU484I6G Frequently Asked Questions (FAQs)

  • The 10CX105YU484I6G FPGA has an operating temperature range of 0°C to 100°C (commercial temperature range) and -40°C to 100°C (industrial temperature range).
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Intel provides a PCB design guide for the 10CX105YU484I6G FPGA, which recommends a 4-layer PCB with a specific stack-up and routing strategy to minimize signal integrity issues and ensure reliable operation.
  • To optimize timing closure, use the Intel Quartus Prime software to analyze and optimize the design's timing constraints. Additionally, consider using floorplanning, pipelining, and register retiming to improve timing performance.
  • Intel recommends using a combination of high-frequency and low-frequency decoupling capacitors, with values ranging from 0.01 μF to 10 μF, placed close to the FPGA's power pins to minimize power noise and ensure reliable operation.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

10CX105YU484I6G Overview

Use the download button to access the 10CX105YU484I6G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 10CX1, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 10CX105YU484I6G

Showing 0 results