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10CX150YF672I5G - Intel

Description: FPGA Cyclone® 10 GX Family 150000 Cells 20nm Technology 672-Pin FBGA Tray

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PCB Footprints
10CX150YF672I5G - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10CX150YF672I5G - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10CX150YF672I5G Details

  • Manufacturer Part Number:

    10CX150YF672I5G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    27 mm

  • Number of CLBs:

    54770

  • Number of Inputs:

    236

  • Number of Logic Cells:

    150000

  • Number of Outputs:

    236

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    54770 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

10CX150YF672I5G Frequently Asked Questions (FAQs)

  • The 10CX150YF672I5G FPGA has an operating temperature range of 0°C to 100°C (commercial temperature range) and -40°C to 100°C (industrial temperature range).
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Intel provides a PCB design guide for the 10CX150YF672I5G FPGA, which recommends a 4-layer PCB with a specific stack-up, signal routing, and decoupling capacitor placement to minimize signal integrity issues and ensure reliable operation.
  • To optimize power consumption, use the Intel Quartus Prime software to optimize the design for power, reduce clock frequencies, and use the FPGA's built-in power management features, such as the Power Manager IP core. Additionally, consider using a heat sink or thermal management system to reduce heat generation.
  • The recommended settings for configuration and programming can be found in the Intel Quartus Prime software and the 10CX150YF672I5G FPGA's datasheet. These settings include the configuration mode, data rate, and programming file format.

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10CX150YF672I5G Overview

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