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10CX220YF672E6G - Intel

Description: FPGA Cyclone® 10 GX Family 220000 Cells 20nm Technology 672-Pin FC-FBGA Tray

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PCB Footprints
10CX220YF672E6G - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10CX220YF672E6G - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10CX220YF672E6G Details

  • Manufacturer Part Number:

    10CX220YF672E6G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    27 mm

  • Number of CLBs:

    80330

  • Number of Inputs:

    236

  • Number of Logic Cells:

    220000

  • Number of Outputs:

    236

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Organization:

    80330 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

10CX220YF672E6G Frequently Asked Questions (FAQs)

  • The 10CX220YF672E6G FPGA has an operating temperature range of 0°C to 100°C (commercial temperature range) and -40°C to 100°C (industrial temperature range).
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Intel provides a PCB design guide for the 10CX220YF672E6G FPGA, which recommends a 4-layer PCB with a specific stack-up, signal routing, and decoupling capacitor placement to minimize signal integrity issues and ensure reliable operation.
  • To optimize power consumption, use the Intel Quartus Prime software to optimize the design for power, reduce clock frequencies, and use the FPGA's built-in power management features, such as dynamic voltage and frequency scaling. Additionally, consider using a heat sink or thermal management system to reduce heat generation.
  • The 10CX220YF672E6G FPGA requires a JTAG interface for configuration and programming. Intel provides a JTAG configuration guide, which outlines the specific requirements for JTAG cable connections, voltage levels, and programming software settings.

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10CX220YF672E6G Overview

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