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10M02DCU324C8G - Intel

Description: FPGA - Field Programmable Gate Array non-volatile FPGA, 160 I/O, 324UBGA

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PCB Footprints
10M02DCU324C8G - Intel PCB footprint - BGA - BGA - 324-Pin Ultra FineLine Ball-Grid Array
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3D Models
10M02DCU324C8G - Intel  - 3D model - BGA - 324-Pin Ultra FineLine Ball-Grid Array
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10M02DCU324C8G Details

  • Manufacturer Part Number:

    10M02DCU324C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    125

  • Number of Inputs:

    246

  • Number of Logic Cells:

    2000

  • Number of Outputs:

    246

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

10M02DCU324C8G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M02DCU324C8G is -40°C to 100°C.
  • To implement a CDC in the 10M02DCU324C8G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum frequency achievable with the 10M02DCU324C8G depends on the specific design and implementation, but Intel's Quartus II software can help estimate the maximum frequency based on the design's complexity and resource utilization.
  • To optimize power consumption in your design, use Intel's PowerPlay power analysis and optimization tool, and implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • The 10M02DCU324C8G can be configured using JTAG, AS, or PS mode, and can also be configured using external memory devices such as flash or SRAM.

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