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10M02SCE144A7G - Intel

Description: FPGA MAX 10 Family 2000 Cells 55nm Technology 1.2V Automotive 144-Pin EQFP EP

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10M02SCE144A7G - Intel - PCB symbol
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PCB Footprints
10M02SCE144A7G - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - EQFP (A:1.65 - D2:4.00)
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3D Models
10M02SCE144A7G - Intel - 3D model - Quad Flat Packages - EQFP (A:1.65 - D2:4.00)
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10M02SCE144A7G Details

  • Manufacturer Part Number:

    10M02SCE144A7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    125

  • Number of Inputs:

    246

  • Number of Logic Cells:

    2000

  • Number of Outputs:

    246

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    HQFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

10M02SCE144A7G Frequently Asked Questions (FAQs)

  • Intel recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
  • Intel recommends a power-up sequence of VCCIO, then VCC, and finally VREF. A power-down sequence of VREF, then VCC, and finally VCCIO is recommended. A minimum of 10 ms delay is recommended between power-up and power-down sequences.
  • The maximum operating temperature for the 10M02SCE144A7G is 100°C (TJ). However, Intel recommends operating the device at a maximum temperature of 85°C (TJ) for optimal reliability and performance.
  • Intel recommends using asynchronous FIFOs or synchronizers to handle clock domain crossing. Additionally, Intel provides IP cores and design examples to help implement CDC in the 10M02SCE144A7G.
  • Intel recommends using the Quartus II software to configure the 10M02SCE144A7G. The software provides a user-friendly interface to configure the device's registers, clock settings, and other parameters.

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10M02SCE144A7G Overview

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