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10M02SCE144I7G - Intel

Description: Intel MAX 10 FPGA

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10M02SCE144I7G - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - MX-10
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10M02SCE144I7G - Intel  - 3D model - Quad Flat Packages - MX-10
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10M02SCE144I7G Details

  • Manufacturer Part Number:

    10M02SCE144I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    125

  • Number of Inputs:

    246

  • Number of Logic Cells:

    2000

  • Number of Outputs:

    246

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    HQFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

10M02SCE144I7G Frequently Asked Questions (FAQs)

  • The maximum junction temperature for the 10M02SCE144I7G is 100°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To implement a clock domain crossing in the 10M02SCE144I7G, you can use Intel's recommended CDC techniques, such as using synchronizers, FIFOs, or asynchronous FIFOs. You can also use Intel's IP cores, such as the CDC IP, to simplify the implementation.
  • The power consumption of the 10M02SCE144I7G depends on the specific use case and design implementation. However, according to the datasheet, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 1.5W to 3.5W, depending on the clock frequency and activity factor.
  • Yes, the 10M02SCE144I7G is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems. It has been designed and tested to meet the requirements of these applications, including radiation tolerance and fault tolerance.
  • To optimize the performance of your design on the 10M02SCE144I7G, you can use Intel's Quartus Prime software to optimize the placement and routing of your design. You can also use techniques such as pipelining, parallel processing, and resource sharing to improve performance.

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