Part Image

10M02SCM153C8G - Intel

Description: FPGA - Field Programmable Gate Array

Download 10M02SCM153C8G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
10M02SCM153C8G - Intel PCB footprint - BGA - BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA) – Wire Bond - A:1.00
click to zoom
3D Models
10M02SCM153C8G - Intel  - 3D model - BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA) – Wire Bond - A:1.00
click to zoom

10M02SCM153C8G Details

  • Manufacturer Part Number:

    10M02SCM153C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B153

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    125

  • Number of Inputs:

    246

  • Number of Logic Cells:

    2000

  • Number of Outputs:

    246

  • Number of Terminals:

    153

  • Operating Temperature-Max:

    85 °C

  • Organization:

    125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA153,15X15,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

10M02SCM153C8G Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the 10M02SCM153C8G, which includes recommendations for PCB layout and routing to minimize signal integrity issues and ensure optimal performance.
  • The 10M02SCM153C8G has a power management scheme that can be implemented using the Power Management Controller (PMC) and the Power-On Reset (POR) circuit. Intel provides guidelines for power management in the device's user manual.
  • The 10M02SCM153C8G has a thermal design power (TDP) of 12W. Intel recommends using a heat sink or a thermal interface material to manage thermal dissipation. The device's thermal management guidelines are provided in the user manual.
  • The 10M02SCM153C8G has a clock management system that allows for flexible clocking and timing configurations. Intel provides guidelines for clocking and timing in the device's user manual, as well as a clocking and timing wizard in the Intel Quartus Prime software.
  • The 10M02SCM153C8G has a range of security features, including AES encryption, secure boot, and a hardware-based root of trust. Intel provides guidelines for implementing these security features in the device's user manual and security documentation.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

10M02SCM153C8G Overview

Use the download button to access the 10M02SCM153C8G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 10M02, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 10M02SCM153C8G

Showing 0 results