10M02SCM153I7G footprint, schematic symbol and 3D model by Intel

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PCB Footprints

10M02SCM153I7G - Intel PCB footprint - BGA - BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA) – Wire Bond - A:1.00

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3D Models

10M02SCM153I7G - Intel - 3D model - BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA) – Wire Bond - A:1.00

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Datasheet Download Datasheet
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Part Number 10M02SCM153I7G
Manufacturer Intel
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153-Pin Micro FineLine Ball-Grid Array (MBGA) – Wire Bond - A:1.00
Released Date Dec 26, 2018
Last Modified Date Jun 22, 2023 2:40 AM UTC
Pinout / Pin List Click Here (Member Only)

10M02SCM153I7G Details

Manufacturer Part Number:
10M02SCM153I7G
Rohs Code:
Yes
Part Life Cycle Code:
Transferred
Country Of Origin:
Mainland China, Malaysia, Taiwan, USA, Vietnam
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Intel Corporation
YTEOL:
7
Additional Feature:
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY
JESD-30 Code:
S-PBGA-B153
Length:
8 mm
Moisture Sensitivity Level:
3
Number of CLBs:
125
Number of Inputs:
246
Number of Logic Cells:
2000
Number of Outputs:
246
Number of Terminals:
153
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Organization:
125 CLBS
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA153,15X15,20
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
260
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Supply Voltage-Max:
3.15 V
Supply Voltage-Min:
2.85 V
Supply Voltage-Nom:
3 V
Surface Mount:
YES
Technology:
55 nm
Temperature Grade:
INDUSTRIAL
Terminal Form:
BALL
Terminal Pitch:
0.5 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
8 mm

10M02SCM153I7G Frequently Asked Questions (FAQs)

Intel recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
Intel recommends a power-up sequence of VCCIO, then VCC, and finally VREF. A power-down sequence of VREF, then VCC, and finally VCCIO is recommended. A minimum of 10 ms delay is recommended between power-up and power-down sequences.
The maximum operating temperature for the 10M02SCM153I7G is 100°C (TJ). However, Intel recommends operating the device at a maximum temperature of 85°C (TJ) for optimal reliability and performance.
The 10M02SCM153I7G supports JTAG debugging through the IEEE 1149.1 standard. A JTAG interface is required to connect to the device's TDI, TDO, TCK, and TMS pins. Intel recommends using a JTAG adapter or a third-party JTAG debugger for debugging purposes.
The recommended clock frequency for the 10M02SCM153I7G is 100 MHz. However, the device can operate at frequencies up to 200 MHz with reduced performance and power consumption.

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