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10M02SCU324C8G - Intel

Description: FPGA MAX 10 Family 2000 Cells 55nm Technology 1.2V 324-Pin UFBGA

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PCB Footprints
10M02SCU324C8G - Intel PCB footprint - BGA - BGA - 324-Pin Ultra FineLine Ball-Grid Array
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3D Models
10M02SCU324C8G - Intel  - 3D model - BGA - 324-Pin Ultra FineLine Ball-Grid Array
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10M02SCU324C8G Details

  • Manufacturer Part Number:

    10M02SCU324C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Number of CLBs:

    125

  • Number of Inputs:

    246

  • Number of Logic Cells:

    2000

  • Number of Outputs:

    246

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

10M02SCU324C8G Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for this FPGA, which includes recommendations for layout, routing, and thermal management. It's essential to follow these guidelines to ensure signal integrity and thermal performance.
  • To optimize power consumption, use the Intel Power Estimator tool to estimate power consumption based on your design. Then, implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Ensure good airflow around the FPGA, use a heat sink or fan if necessary, and implement thermal management techniques such as thermal throttling and dynamic voltage and frequency scaling. Intel also provides thermal design guidelines for this FPGA.
  • Use the Intel Signal Integrity Tool to analyze and optimize signal integrity. Implement signal integrity best practices such as using differential signaling, minimizing trace lengths, and using termination resistors.
  • The internal oscillator has limited accuracy and stability. For more accurate clocking, use an external clock source, such as a crystal oscillator or a clock generator. Intel provides guidelines for using external clock sources with this FPGA.

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10M02SCU324C8G Overview

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