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10M04DCF256I7G - Intel

Description: FPGA MAX 10 Family 4000 Cells 55nm Technology 1.2V 256-Pin FBGA

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10M04DCF256I7G - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
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3D Models
10M04DCF256I7G - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
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10M04DCF256I7G Details

  • Manufacturer Part Number:

    10M04DCF256I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    250

  • Number of Inputs:

    246

  • Number of Logic Cells:

    4000

  • Number of Outputs:

    246

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    250 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

10M04DCF256I7G Frequently Asked Questions (FAQs)

  • The 10M04DCF256I7G has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • Intel provides guidelines for CDC implementation in their documentation. It's essential to use synchronizers, FIFOs, or other CDC techniques to ensure data integrity when crossing clock domains.
  • The power consumption of the 10M04DCF256I7G depends on the design and usage. Intel provides power estimation tools, and optimizing power consumption can be achieved by using low-power modes, clock gating, and other power-saving techniques.
  • To ensure signal integrity and reduce EMI, follow Intel's guidelines for PCB design, use differential signaling, and implement EMI reduction techniques such as shielding, filtering, and grounding.
  • The 10M04DCF256I7G has limitations on the number of logic elements, memory blocks, and I/O pins. It's essential to plan and optimize resource utilization to ensure the design fits within these constraints.

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10M04DCF256I7G Overview

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