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10M04SAM153I7G - Intel

Description: FPGA MAX 10 Family 4000 Cells 55nm Technology 1.2V 153-Pin MBGA

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PCB Footprints
10M04SAM153I7G - Intel PCB footprint - BGA - BGA - 153-MBGA (8x8)
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3D Models
10M04SAM153I7G - Intel  - 3D model - BGA - 153-MBGA (8x8)
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10M04SAM153I7G Details

  • Manufacturer Part Number:

    10M04SAM153I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B153

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    250

  • Number of Inputs:

    246

  • Number of Logic Cells:

    4000

  • Number of Outputs:

    246

  • Number of Terminals:

    153

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    250 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA153,15X15,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

10M04SAM153I7G Frequently Asked Questions (FAQs)

  • The maximum junction temperature for the 10M04SAM153I7G is 100°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To implement a clock domain crossing in the 10M04SAM153I7G, you can use Intel's recommended CDC techniques, such as using asynchronous FIFOs or synchronizers. You can also use the FPGA's built-in CDC IP cores or implement your own custom CDC logic.
  • The power consumption of the 10M04SAM153I7G depends on the specific use case and design implementation. However, according to the datasheet, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 1.5W to 3.5W depending on the clock frequency and activity factor.
  • Yes, the 10M04SAM153I7G is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems. However, you should follow Intel's guidelines for designing and implementing reliable systems, including using error correction codes, redundant logic, and robust clocking schemes.
  • To optimize timing closure for the 10M04SAM153I7G, you can use Intel's Quartus II software to analyze and optimize the design's timing performance. This includes using the software's built-in timing analysis tools, optimizing clock domains, and using pipelining and retiming techniques to improve timing closure.

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10M04SAM153I7G Overview

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