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10M08DAF484I7G - Intel

Description: FPGA MAX 10 Family 8000 Cells 55nm Technology 1.2V 484-Pin TFBGA

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PCB Footprints
10M08DAF484I7G - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00----
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3D Models
10M08DAF484I7G - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00----
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10M08DAF484I7G Details

  • Manufacturer Part Number:

    10M08DAF484I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    500

  • Number of Inputs:

    250

  • Number of Logic Cells:

    8000

  • Number of Outputs:

    250

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

10M08DAF484I7G Frequently Asked Questions (FAQs)

  • The 10M08DAF484I7G has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • Intel provides guidelines for CDC implementation in their documentation. It's essential to use synchronizers, FIFOs, or other CDC techniques to ensure data integrity when crossing clock domains.
  • The power consumption of the 10M08DAF484I7G depends on the specific design and usage. However, Intel provides power estimation tools and guidelines to help estimate power consumption. Typically, the total power consumption is around 1-2 watts.
  • Yes, the 10M08DAF484I7G is capable of supporting high-speed interfaces like PCIe Gen2 and Ethernet. However, it's essential to follow Intel's guidelines and implement proper signal integrity and PCB design to ensure reliable operation.
  • Intel provides a range of security features, including bitstream encryption, authentication, and secure boot mechanisms. It's essential to follow Intel's security guidelines and implement secure design practices to protect your IP.

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10M08DAF484I7G Overview

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