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10M08DAU324I7G - Intel

Description: FPGA MAX 10 Family 8000 Cells 55nm Technology 1.2V 324-Pin UFBGA

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PCB Footprints
10M08DAU324I7G - Intel PCB footprint - BGA - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond -  A:1.55
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3D Models
10M08DAU324I7G - Intel  - 3D model - BGA - 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond -  A:1.55
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10M08DAU324I7G Details

  • Manufacturer Part Number:

    10M08DAU324I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    500

  • Number of Inputs:

    250

  • Number of Logic Cells:

    8000

  • Number of Outputs:

    250

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

10M08DAU324I7G Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10M08DAU324I7G is approximately 1.1W, but this can vary depending on the specific use case and design implementation.
  • To implement a CDC in the 10M08DAU324I7G, you can use the built-in FIFOs and synchronizers, or implement a custom CDC using the FPGA's fabric and clocking resources. Intel provides guidelines and IP cores to help with CDC implementation.
  • Yes, the 10M08DAU324I7G is capable of supporting high-speed serial interfaces like PCIe and SATA, but it requires careful design and implementation to ensure signal integrity and compliance with the relevant standards.
  • To optimize the 10M08DAU324I7G for low power consumption, you can use Intel's PowerPlay power analysis tool, implement power gating, and optimize your design for low power using techniques like clock gating and voltage scaling.
  • Yes, the 10M08DAU324I7G has built-in cryptographic primitives and can be used for cryptographic applications, but it's essential to follow Intel's guidelines and recommendations for secure implementation.

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10M08DAU324I7G Overview

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