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10M08SAU169C8G - Intel

Description: 169-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.55

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10M08SAU169C8G - Intel PCB footprint - BGA - BGA - 169-Pin Ultra FineLine Ball-Grid Array (UBGA)
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3D Models
10M08SAU169C8G - Intel  - 3D model - BGA - 169-Pin Ultra FineLine Ball-Grid Array (UBGA)
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10M08SAU169C8G Details

  • Manufacturer Part Number:

    10M08SAU169C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B169

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    500

  • Number of Inputs:

    250

  • Number of Logic Cells:

    8000

  • Number of Outputs:

    250

  • Number of Terminals:

    169

  • Operating Temperature-Max:

    85 °C

  • Organization:

    500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA169,13X13,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

10M08SAU169C8G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M08SAU169C8G is -40°C to 100°C.
  • To implement a CDC in the 10M08SAU169C8G, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity across clock domains.
  • The maximum frequency achievable with the 10M08SAU169C8G depends on the specific design and implementation, but Intel's Quartus II software can help estimate the maximum frequency based on the design's complexity and resource utilization.
  • To optimize power consumption in the 10M08SAU169C8G, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • The 10M08SAU169C8G can be configured using JTAG, AS, or PS mode, and can also be configured using external memory devices such as flash or SRAM.

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