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10M16DAF256A7G - Intel

Description: FPGA MAX 10 Family 16000 Cells 55nm Technology 1.2V Automotive AEC-Q100 256-Pin FBGA

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PCB Footprints
10M16DAF256A7G - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA)_2026
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10M16DAF256A7G Details

  • Manufacturer Part Number:

    10M16DAF256A7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Number of CLBs:

    1000

  • Number of Inputs:

    320

  • Number of Logic Cells:

    16000

  • Number of Outputs:

    320

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M16DAF256A7G Frequently Asked Questions (FAQs)

  • The 10M16DAF256A7G has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • Intel provides guidelines for CDC implementation in their documentation. It's essential to use synchronous clock domains and follow Intel's recommended CDC techniques to ensure reliable data transfer.
  • The maximum frequency achievable with the 10M16DAF256A7G depends on the specific design and implementation. However, Intel provides guidelines for achieving high frequencies, and with proper design and optimization, frequencies up to 500 MHz or more can be achieved.
  • To optimize power consumption, use Intel's PowerPlay power analysis tool to identify areas of high power consumption. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Implement a synchronous reset strategy using Intel's recommended reset architecture. This ensures that all registers and flip-flops are properly reset, and the design can recover from a reset event.

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