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10M16DAF256I7G - Intel

Description: FPGA MAX 10 Family 16000 Cells 55nm Technology 1.2V 256-Pin TFBGA

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10M16DAF256I7G - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA
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10M16DAF256I7G - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA
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10M16DAF256I7G Details

  • Manufacturer Part Number:

    10M16DAF256I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1000

  • Number of Inputs:

    320

  • Number of Logic Cells:

    16000

  • Number of Outputs:

    320

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M16DAF256I7G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M16DAF256I7G is -40°C to 100°C.
  • To implement a CDC in the 10M16DAF256I7G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated.
  • The maximum frequency achievable with the 10M16DAF256I7G depends on the specific design and implementation, but Intel's Quartus II software can help estimate the maximum frequency.
  • To optimize power consumption, use Intel's PowerPlay power analysis tool, reduce clock frequencies, and implement power-gating and dynamic voltage and frequency scaling (DVFS) techniques.
  • Yes, the 10M16DAF256I7G is suitable for high-reliability applications, such as aerospace and defense, due to its radiation-hardened design and error correction capabilities.

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