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10M16DAF484C8G - Intel

Description: FPGA MAX 10 Family 16000 Cells 55nm Technology 1.2V 484-Pin TFBGA

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PCB Footprints
10M16DAF484C8G - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond -  A:2.00
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10M16DAF484C8G Details

  • Manufacturer Part Number:

    10M16DAF484C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1000

  • Number of Inputs:

    320

  • Number of Logic Cells:

    16000

  • Number of Outputs:

    320

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

10M16DAF484C8G Frequently Asked Questions (FAQs)

  • The 10M16DAF484C8G has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • Intel provides a Clock Tree Synthesis (CTS) tool that helps optimize clock tree implementation. Additionally, the Quartus II software provides guidelines and best practices for clock tree implementation.
  • The maximum frequency achievable with the 10M16DAF484C8G depends on the specific design and implementation. However, Intel provides guidelines and tools to help optimize design performance, and frequencies up to 500 MHz are achievable with careful design and optimization.
  • Intel provides signal integrity analysis tools and guidelines to help ensure signal integrity in your design. Additionally, following best practices for PCB design, such as using differential pairs and minimizing signal routing, can help ensure signal integrity.
  • The power consumption of the 10M16DAF484C8G depends on the specific design and implementation. However, Intel provides power estimation tools and guidelines to help estimate power consumption. Typical power consumption ranges from 1-5 watts, depending on the design.

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10M16DAF484C8G Overview

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