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10M16DCF484I7G - Intel

Description: FPGA MAX 10 Family 16000 Cells 55nm Technology 1.2V 484-Pin TFBGA

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PCB Footprints
10M16DCF484I7G - Intel PCB footprint - BGA - BGA - 10M50DAF484C6GES
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3D Models
10M16DCF484I7G - Intel  - 3D model - BGA - 10M50DAF484C6GES
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10M16DCF484I7G Details

  • Manufacturer Part Number:

    10M16DCF484I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1000

  • Number of Inputs:

    320

  • Number of Logic Cells:

    16000

  • Number of Outputs:

    320

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

10M16DCF484I7G Frequently Asked Questions (FAQs)

  • The 10M16DCF484I7G has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of applications.
  • Intel provides a Clock Tree Synthesis (CTS) tool as part of the Quartus II software, which helps to implement a clock tree in the FPGA. The tool takes into account the device's clocking architecture and the user's clocking requirements to generate an optimal clock tree.
  • The power consumption of the 10M16DCF484I7G depends on various factors such as the device utilization, clock frequency, and operating conditions. Intel provides a PowerPlay Early Power Estimator (EPE) tool that can be used to estimate the power consumption of the device based on the design requirements.
  • Intel provides a DDR3 memory interface IP core that can be used to implement a DDR3 memory interface in the FPGA. The IP core is available in the Quartus II software and provides a pre-verified and optimized implementation of the DDR3 interface.
  • The 10M16DCF484I7G has transceivers that support data transfer rates of up to 10 Gbps, making it suitable for high-speed applications such as Ethernet, PCIe, and SATA.

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10M16DCF484I7G Overview

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