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10M16DCU324I7G - Intel

Description: FPGA MAX 10 Family 16000 Cells 55nm Technology 1.2V 324-Pin UFBGA

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10M16DCU324I7G - Intel  - 3D model
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10M16DCU324I7G Details

  • Manufacturer Part Number:

    10M16DCU324I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1000

  • Number of Inputs:

    320

  • Number of Logic Cells:

    16000

  • Number of Outputs:

    320

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

10M16DCU324I7G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M16DCU324I7G is -40°C to 100°C.
  • To implement a CDC in the 10M16DCU324I7G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum frequency achievable with the 10M16DCU324I7G depends on the specific design and implementation, but Intel's Quartus II software can help estimate the maximum frequency based on the design's complexity and resource utilization.
  • To optimize power consumption in the 10M16DCU324I7G, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling, and leverage Intel's PowerPlay power management features.
  • The 10M16DCU324I7G can be configured using JTAG, AS, or PS mode, and can also be configured using external memory devices such as flash or SRAM.

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10M16DCU324I7G Overview

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