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10M16SCE144I7G - Intel

Description: FPGA MAX 10 Family 16000 Cells 55nm Technology 1.2V 144-Pin EQFP EP

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10M16SCE144I7G - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
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10M16SCE144I7G - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 10M16SCE144I7G
  • Part Number 10M16SCE144I7G
  • Manufacturer Intel
  • Pin Count 145
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
  • Released Date Sep 1, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

10M16SCE144I7G Details

  • Manufacturer Part Number:

    10M16SCE144I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    QFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1000

  • Number of Inputs:

    320

  • Number of Logic Cells:

    16000

  • Number of Outputs:

    320

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

10M16SCE144I7G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M16SCE144I7G is -40°C to 100°C.
  • To implement a CDC in the 10M16SCE144I7G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated.
  • The maximum frequency achievable with the 10M16SCE144I7G depends on the specific design and implementation, but it can reach up to 500 MHz.
  • To optimize power consumption, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Use the Intel FPGA's DDR3 memory interface IP core, which provides a pre-verified and optimized interface for DDR3 memory.

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