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10M16SCU169I7G - Intel

Description: FPGA - Field Programmable Gate Array non-volatile FPGA, 130 I/O, 169UBGA

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10M16SCU169I7G - Intel PCB footprint - BGA - BGA - 169-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.5
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10M16SCU169I7G - Intel  - 3D model - BGA - 169-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.5
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10M16SCU169I7G Details

  • Manufacturer Part Number:

    10M16SCU169I7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B169

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1000

  • Number of Inputs:

    320

  • Number of Logic Cells:

    16000

  • Number of Outputs:

    320

  • Number of Terminals:

    169

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA169,13X13,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

10M16SCU169I7G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M16SCU169I7G is -40°C to 100°C.
  • To implement a CDC in the 10M16SCU169I7G, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity across clock domains.
  • The maximum frequency achievable with the 10M16SCU169I7G depends on the specific design and implementation, but Intel's Quartus II software can help estimate the maximum frequency for a given design.
  • To optimize power consumption in the 10M16SCU169I7G, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • The available development tools and software for the 10M16SCU169I7G include Intel's Quartus II software, ModelSim-Altera simulation software, and the SoC Embedded Design Suite (EDS).

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