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10M25DAF256C7G - Intel

Description: FPGA MAX 10 Family 25000 Cells 55nm Technology 1.2V 256-Pin TFBGA

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10M25DAF256C7G - Intel PCB footprint - BGA - BGA - 256 pin FBGA-1
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10M25DAF256C7G - Intel  - 3D model - BGA - 256 pin FBGA-1
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10M25DAF256C7G Details

  • Manufacturer Part Number:

    10M25DAF256C7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1563

  • Number of Inputs:

    360

  • Number of Logic Cells:

    25000

  • Number of Outputs:

    360

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1563 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M25DAF256C7G Frequently Asked Questions (FAQs)

  • The 10M25DAF256C7G has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • Intel provides guidelines for CDC implementation in their documentation, including the use of synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
  • The power consumption of the 10M25DAF256C7G depends on the specific design and usage. Intel provides power estimation tools and guidelines for power optimization, including clock gating, voltage scaling, and other techniques.
  • Intel provides guidelines for signal integrity and EMI reduction, including the use of differential signaling, shielding, and other techniques to minimize electromagnetic radiation and ensure reliable signal transmission.
  • The 10M25DAF256C7G has a limited number of logic elements, memory blocks, and other resources. Intel provides guidelines for resource utilization and optimization, including the use of resource-efficient design techniques and IP cores.

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