Part Image

10M25DCF256C8G - Intel

Description: FPGA MAX 10 Family 25000 Cells 55nm Technology 1.2V 256-Pin FBGA

Download 10M25DCF256C8G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
10M25DCF256C8G - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA
click to zoom
3D Models
10M25DCF256C8G - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA
click to zoom

10M25DCF256C8G Details

  • Manufacturer Part Number:

    10M25DCF256C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1563

  • Number of Inputs:

    360

  • Number of Logic Cells:

    25000

  • Number of Outputs:

    360

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1563 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 55 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M25DCF256C8G Frequently Asked Questions (FAQs)

  • The 10M25DCF256C8G has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • Intel provides guidelines for CDC implementation in their documentation. It's essential to use synchronizers, FIFOs, or other CDC techniques to ensure data integrity across clock domains.
  • The power consumption of the 10M25DCF256C8G depends on the design and usage. Intel provides power estimation tools, and optimizing power consumption can be achieved by using low-power modes, clock gating, and other power-saving techniques.
  • Yes, the 10M25DCF256C8G supports high-speed interfaces like PCIe Gen2 and Ethernet. However, it's essential to follow Intel's guidelines and implement proper signal integrity and PCB design to ensure reliable operation.
  • Intel provides a range of security features, including bitstream encryption, authentication, and secure boot mechanisms. It's essential to follow Intel's security guidelines and implement secure design practices to protect your IP.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

10M25DCF256C8G Overview

Use the download button to access the 10M25DCF256C8G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 10M25, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 10M25DCF256C8G

Showing 0 results