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10M40DAF256C8G - Intel

Description: FPGA - Field Programmable Gate Array non-volatile FPGA, 178 I/O, 256FBGA

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10M40DAF256C8G - Intel - PCB symbol
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PCB Footprints
10M40DAF256C8G - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
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3D Models
10M40DAF256C8G - Intel - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
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10M40DAF256C8G Details

  • Manufacturer Part Number:

    10M40DAF256C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2500

  • Number of Inputs:

    500

  • Number of Logic Cells:

    40000

  • Number of Outputs:

    500

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M40DAF256C8G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M40DAF256C8G is -40°C to 100°C.
  • Intel recommends using a POR circuit with a minimum pulse width of 10 ms and a maximum voltage of 3.3V to ensure reliable operation.
  • Intel recommends following the PCB layout and routing guidelines outlined in the Intel FPGA PCB Design Guidelines document, which includes recommendations for signal integrity, power distribution, and thermal management.
  • To optimize timing closure, Intel recommends using the Intel Quartus Prime software to analyze and optimize the design, as well as following best practices for clock domain crossing, pipelining, and register placement.
  • The recommended settings for the VRM depend on the specific application and power requirements, but Intel recommends following the guidelines outlined in the 10M40DAF256C8G datasheet and using the Intel Power Estimator tool to estimate power consumption.

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10M40DAF256C8G Overview

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