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10M40DAF484C8G - Intel

Description: FPGA MAX 10 Family 40000 Cells 55nm Technology 1.2V 484-Pin TFBGA

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PCB Footprints
10M40DAF484C8G - Intel PCB footprint - BGA - BGA - 484-FBGA (23x23)
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3D Models
10M40DAF484C8G - Intel  - 3D model - BGA - 484-FBGA (23x23)
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10M40DAF484C8G Details

  • Manufacturer Part Number:

    10M40DAF484C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2500

  • Number of Inputs:

    500

  • Number of Logic Cells:

    40000

  • Number of Outputs:

    500

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

10M40DAF484C8G Frequently Asked Questions (FAQs)

  • The 10M40DAF484C8G has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • Intel recommends using a POR circuit with a minimum reset pulse width of 10 ms to ensure reliable operation. A simple POR circuit can be implemented using a resistor, capacitor, and diode.
  • Intel provides a PCB design guide for the 10M40DAF484C8G, which recommends a 4-layer PCB with a dedicated power plane, signal routing on the top and bottom layers, and careful attention to signal integrity and decoupling.
  • To optimize timing closure, use the Intel Quartus Prime software to analyze and optimize the design. This includes using the Timing Analyzer tool, optimizing clock domains, and using pipelining and retiming techniques.
  • Intel recommends using 0.1 μF and 10 μF decoupling capacitors, placed as close as possible to the FPGA's power pins, to ensure reliable power supply decoupling.

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