Part Image

10M40DCF256A7G - Intel

Description: FPGA - Field Programmable Gate Array

Download 10M40DCF256A7G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
10M40DCF256A7G - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
click to zoom
3D Models
10M40DCF256A7G - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
click to zoom

10M40DCF256A7G Details

  • Manufacturer Part Number:

    10M40DCF256A7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Number of CLBs:

    2500

  • Number of Inputs:

    500

  • Number of Logic Cells:

    40000

  • Number of Outputs:

    500

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 55 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M40DCF256A7G Frequently Asked Questions (FAQs)

  • The 10M40DCF256A7G has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • Intel provides guidelines for CDC implementation in their documentation. It's essential to use synchronizers, FIFOs, or other CDC techniques to ensure data integrity when crossing clock domains.
  • The power consumption of the 10M40DCF256A7G depends on the design and usage. Intel provides power estimation tools, and optimizing power consumption can be achieved by using low-power modes, clock gating, and other power-saving techniques.
  • To ensure signal integrity and reduce EMI, follow Intel's guidelines for PCB design, use differential signaling, and implement proper termination and shielding techniques.
  • Intel provides the Quartus Prime Design Software, which includes a comprehensive development environment for designing, simulating, and implementing FPGA designs.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

10M40DCF256A7G Overview

Use the download button to access the 10M40DCF256A7G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 10M40, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 10M40DCF256A7G

Showing 0 results