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10M40SCE144A7G - Intel

Description: FPGA MAX 10 Family 40000 Cells 55nm Technology 1.2V Automotive 144-Pin EQFP EP

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10M40SCE144A7G - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144 eqfp ep
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10M40SCE144A7G - Intel  - 3D model - Quad Flat Packages - 144 eqfp ep
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10M40SCE144A7G Details

  • Manufacturer Part Number:

    10M40SCE144A7G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Number of CLBs:

    2500

  • Number of Inputs:

    500

  • Number of Logic Cells:

    40000

  • Number of Outputs:

    500

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    HQFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    3.15 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

10M40SCE144A7G Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the 10M40SCE144A7G, which includes recommendations for PCB layout, thermal management, and power delivery. It's essential to follow these guidelines to ensure optimal performance, signal integrity, and thermal dissipation.
  • Intel recommends using a dedicated POR circuit, such as the TPS3106 or TPS389, to ensure a reliable power-on reset. The POR circuit should be designed to meet the FPGA's power-up sequencing requirements and provide a clean reset signal.
  • For high-speed interfaces, it's crucial to follow Intel's signal integrity guidelines, including using controlled impedance traces, minimizing signal lengths, and avoiding vias and stubs. Additionally, using simulation tools like IBIS-AMI models and HyperLynx can help optimize signal integrity.
  • To optimize power consumption, use Intel's Power Estimator tool to analyze the design's power requirements. Implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and use low-power modes when possible. Additionally, consider using a heat sink or thermal interface material to reduce heat generation.
  • Intel provides a configuration and programming guide for the 10M40SCE144A7G, which includes recommended settings for configuration modes, data rates, and programming algorithms. It's essential to follow these guidelines to ensure reliable configuration and programming of the FPGA.

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10M40SCE144A7G Overview

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