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10M50DAF484C8G - Intel

Description: FPGA MAX 10 Family 50000 Cells 55nm Technology 1.2V 484-Pin TFBGA

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PCB Footprints
10M50DAF484C8G - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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3D Models
10M50DAF484C8G - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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10M50DAF484C8G Details

  • Manufacturer Part Number:

    10M50DAF484C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3125

  • Number of Inputs:

    500

  • Number of Logic Cells:

    50000

  • Number of Outputs:

    500

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

10M50DAF484C8G Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10M50DAF484C8G is approximately 2.5W, but this can vary depending on the specific design and usage.
  • To implement a CDC in the 10M50DAF484C8G, you can use Intel's recommended CDC techniques, such as using synchronizers, FIFOs, or using a CDC IP core from Intel.
  • The maximum frequency of the 10M50DAF484C8G is approximately 500 MHz, but this can vary depending on the specific design and usage.
  • To optimize timing closure, use Intel's Quartus II software to analyze and optimize your design. You can also use techniques such as pipelining, retiming, and register balancing to improve timing.
  • The 10M50DAF484C8G has approximately 50,000 LEs available.

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