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10M50DCF256C8G - Intel

Description: FPGA - Field Programmable Gate Array non-volatile FPGA, 178 I/O, 256FBGA

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10M50DCF256C8G - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA
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10M50DCF256C8G - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA
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10M50DCF256C8G Details

  • Manufacturer Part Number:

    10M50DCF256C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3125

  • Number of Inputs:

    500

  • Number of Logic Cells:

    50000

  • Number of Outputs:

    500

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 55 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

10M50DCF256C8G Frequently Asked Questions (FAQs)

  • The 10M50DCF256C8G has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • Intel provides guidelines for CDC implementation in their documentation. It's recommended to use synchronous clock domains, and Intel's IP cores can help with CDC. Additionally, the FPGA's built-in PLLs can be used to generate multiple clock domains.
  • The power consumption of the 10M50DCF256C8G depends on the specific design and usage. However, Intel provides power estimation tools and guidelines to help estimate power consumption. Typically, the FPGA's power consumption ranges from 1-5 watts, depending on the design complexity and clock frequency.
  • Yes, the 10M50DCF256C8G is capable of supporting high-speed serial interfaces like PCIe and SATA. Intel provides IP cores and documentation to help implement these interfaces. The FPGA's high-speed transceivers can operate at speeds up to 12.5 Gbps.
  • Intel provides a range of security features, including bitstream encryption, authentication, and secure boot mechanisms. Additionally, designers can implement their own security measures, such as secure key storage and access control, using the FPGA's built-in resources.

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10M50DCF256C8G Overview

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