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10M50DCF484C8G - Intel

Description: FPGA MAX 10 Family 50000 Cells 55nm Technology 1.2V 484-Pin TFBGA

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PCB Footprints
10M50DCF484C8G - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond -  A:2.00
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3D Models
10M50DCF484C8G - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond -  A:2.00
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10M50DCF484C8G Details

  • Manufacturer Part Number:

    10M50DCF484C8G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3125

  • Number of Inputs:

    500

  • Number of Logic Cells:

    50000

  • Number of Outputs:

    500

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3125 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    55 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

10M50DCF484C8G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 10M50DCF484C8G is -40°C to 100°C, as specified in the Intel FPGA datasheet.
  • Intel recommends using a clocking scheme that includes a clock manager, such as the Intel FPGA Clock Manager IP core, to ensure reliable clock distribution and minimize clock skew.
  • The recommended power supply voltage for the 10M50DCF484C8G is 1.0V ± 5% for the core voltage (VCC) and 1.8V ± 5% for the I/O voltage (VCCIO).
  • To optimize power consumption, Intel recommends using power-aware design techniques, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS), as well as using the Intel FPGA PowerPlay power analysis tool.
  • The maximum data transfer rate for the high-speed transceivers on the 10M50DCF484C8G is up to 12.5 Gbps, depending on the specific transceiver configuration and the application requirements.

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10M50DCF484C8G Overview

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