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1206L175PR - LITTELFUSE

Description: Resettable Fuses - PPTC PTC 6V POLYFUSE 1206 HALOGEN-FREE 1.75A

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Symbol
1206L175PR - LITTELFUSE - PCB symbol
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PCB Footprints
1206L175PR - LITTELFUSE PCB footprint - Other - Other - 1206L035
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3D Models
1206L175PR - LITTELFUSE - 3D model - Other - 1206L035
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1206L175PR Details

  • Manufacturer Part Number:

    1206L175PR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.25

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.8 mm

  • Package Length:

    3.4 mm

  • Package Style:

    SMT

  • Package Width:

    1.8 mm

  • Packing Method:

    TR, 7 INCH

  • Reference Standard:

    CUL; TUV; UL

  • Resistance:

    0.02 Ω

  • Resistor Type:

    PTC RESETTABLE FUSE

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermistor Application:

    OVERCURRENT PROTECTION

  • Working Voltage:

    6 V

1206L175PR Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 1206L175PR is a rectangular pad with a size of 1.5mm x 3.5mm, with a solder mask clearance of 0.5mm around the pad.
  • Yes, the 1206L175PR is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • Handle the 1206L175PR by the body, avoiding touching the leads or the glass passivation layer. Use a vacuum pickup or tweezers to handle the device during assembly and rework.
  • The recommended soldering profile for the 1206L175PR is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The device should be soldered using a solder with a melting point of 180-220°C.
  • Yes, the 1206L175PR is designed to withstand high-vibration environments. However, the device's performance and reliability may be affected by extreme vibration levels.

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1206L175PR Overview

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