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1812L110/16DR - LITTELFUSE

Description: PTC Resettable Fuse 1.1A(hold) 1.95A(trip) 16VDC 100A 0.8W 0.3s 0.06Ohm SMD Solder Pad 1812 T/R

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Symbol
1812L110/16DR - LITTELFUSE - PCB symbol
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PCB Footprints
1812L110/16DR - LITTELFUSE PCB footprint - Fuses Chip - Fuses Chip - 1812L110/16
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3D Models
1812L110/16DR - LITTELFUSE - 3D model - Fuses Chip - 1812L110/16
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1812L110/16DR Details

  • Manufacturer Part Number:

    1812L110/16DR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.25

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.25 mm

  • Package Length:

    4.73 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.41 mm

  • Packing Method:

    TR, 7 INCH

  • Reference Standard:

    CUL; TUV; UL

  • Resistance:

    0.06 Ω

  • Resistor Type:

    PTC RESETTABLE FUSE

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermistor Application:

    OVERCURRENT PROTECTION

  • Working Voltage:

    16 V

1812L110/16DR Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the 1812L110/16DR is between 260°C to 280°C for a maximum of 10 seconds.
  • Yes, the 1812L110/16DR is suitable for high-frequency applications up to 1 GHz due to its low inductance and high self-resonant frequency.
  • The 1812L110/16DR is designed to operate up to 150°C, but its inductance and Q factor may degrade at high temperatures. Consult the datasheet for specific temperature derating information.
  • Yes, the 1812L110/16DR is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The recommended land pattern for the 1812L110/16DR is a rectangular pad with a minimum size of 1.5 mm x 3.5 mm, with a non-solder mask defined (NSMD) pad shape.

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1812L110/16DR Overview

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