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1P1G3157QDCKRQ1 - Texas Instruments

Description: Automotive Catalog Single-Pole, Double-Throw Analog Switch

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PCB Footprints
1P1G3157QDCKRQ1 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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3D Models
1P1G3157QDCKRQ1 - Texas Instruments  - 3D model - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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1P1G3157QDCKRQ1 Details

  • Manufacturer Part Number:

    1P1G3157QDCKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOT-SC70-6

  • Pin Count:

    6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    SPDT

  • Bandwidth-Nom:

    300 MHz

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    57 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    50 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.01 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    7.5 ns

  • Switch-on Time-Max:

    14 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn); Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

1P1G3157QDCKRQ1 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal pad is connected to a solid copper area on the PCB to improve heat dissipation.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, including providing adequate thermal relief, using a stable power supply, and ensuring that the device is operated within its specified voltage and current limits.
  • To mitigate EMI and RFI, it is recommended to use a shielded enclosure, keep the device away from high-frequency sources, use a common-mode choke on the input, and ensure that the PCB layout is designed to minimize radiation and susceptibility.
  • To troubleshoot issues related to output voltage regulation, check the input voltage, output voltage, and output current. Verify that the device is operated within its specified limits, and check for any signs of overheating or oscillation. Use an oscilloscope to monitor the output voltage and current waveforms.
  • Operating the device beyond its specified maximum ratings can lead to reduced reliability, decreased performance, and potentially even device failure. It is essential to ensure that the device is operated within its specified voltage, current, and temperature limits to ensure reliable operation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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