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1SG040HH3F35E3VG - Intel

Description: FPGA Stratix® 10 GX Family 400000 Cells 14nm Technology 1.8V 1152-Pin FBGA

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PCB Footprints
1SG040HH3F35E3VG - Intel PCB footprint - BGA - BGA - 35mm X 35mm, 1152 BGA
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3D Models
1SG040HH3F35E3VG - Intel  - 3D model - BGA - 35mm X 35mm, 1152 BGA
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1SG040HH3F35E3VG Details

  • Manufacturer Part Number:

    1SG040HH3F35E3VG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of CLBs:

    47250

  • Number of Inputs:

    430

  • Number of Logic Cells:

    378000

  • Number of Outputs:

    430

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Organization:

    47250 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.706 mm

  • Supply Voltage-Max:

    0.97 V

  • Supply Voltage-Min:

    0.77 V

  • Supply Voltage-Nom:

    0.8 V

  • Surface Mount:

    YES

  • Technology:

    14 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

1SG040HH3F35E3VG Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the 1SG040HH3F35E3VG, which includes recommendations for PCB layout, thermal design, and heat sink selection. It's essential to follow these guidelines to ensure optimal performance and prevent overheating.
  • The 1SG040HH3F35E3VG requires a specific power sequencing and voltage regulation scheme. Intel recommends using a dedicated power management IC (PMIC) or a custom power supply design that meets the device's power requirements. Consult Intel's application notes and design guides for more information.
  • The 1SG040HH3F35E3VG has specific operating conditions, such as temperature, voltage, and current limits. Ensure reliable operation by following Intel's recommended operating conditions, and implement proper thermal management, power supply, and signal integrity designs.
  • Intel provides debugging tools and guidelines for the 1SG040HH3F35E3VG. Common pitfalls to avoid include incorrect power sequencing, inadequate thermal design, and signal integrity issues. Consult Intel's application notes and troubleshooting guides for more information.
  • The 1SG040HH3F35E3VG must comply with environmental and regulatory requirements, such as RoHS, REACH, and WEEE. Ensure your design meets these requirements by following Intel's guidelines and consulting with regulatory experts.

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1SG040HH3F35E3VG Overview

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