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1ST280EU2F50E2VG - Intel

Description: Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

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1ST280EU2F50E2VG - Intel PCB footprint - BGA - BGA - 2397-Ball FBGA
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1ST280EU2F50E2VG - Intel  - 3D model - BGA - 2397-Ball FBGA
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1ST280EU2F50E2VG Details

  • Manufacturer Part Number:

    1ST280EU2F50E2VG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-2397

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2397

  • JESD-609 Code:

    e1

  • Length:

    50 mm

  • Number of CLBs:

    350000

  • Number of Inputs:

    440

  • Number of Logic Cells:

    2800000

  • Number of Outputs:

    440

  • Number of Terminals:

    2397

  • Operating Temperature-Max:

    100 °C

  • Organization:

    350000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2397,49X49,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.881 mm

  • Supply Voltage-Max:

    0.97 V

  • Supply Voltage-Min:

    0.77 V

  • Supply Voltage-Nom:

    0.8 V

  • Surface Mount:

    YES

  • Technology:

    14 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    50 mm

1ST280EU2F50E2VG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 1ST280EU2F50E2VG is -40°C to 100°C, as specified in the datasheet.
  • To ensure signal integrity, it is recommended to follow the PCB layout guidelines provided in the datasheet, use controlled impedance traces, and add decoupling capacitors as needed.
  • The recommended power-up sequence for the 1ST280EU2F50E2VG is to power up the VCCIO and VCC cores simultaneously, followed by the VREF and VTT supplies.
  • Thermal management for the 1ST280EU2F50E2VG can be handled through the use of heat sinks, thermal interfaces, and airflow management. The datasheet provides thermal resistance values to aid in thermal design.
  • The 1ST280EU2F50E2VG has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and testing to prevent damage.

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