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2N5116 - InterFET

Description: JFET P-Channel 30V Low Noise

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PCB Footprints
2N5116 - InterFET PCB footprint - Other - Other - TO-18
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2N5116 - InterFET  - 3D model - Other - TO-18
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2N5116 Details

  • Manufacturer Part Number:

    2N5116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • Manufacturer:

    InterFET Corporation

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE

  • Drain-source On Resistance-Max:

    150 Ω

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    7 pF

  • JEDEC-95 Code:

    TO-18

  • JESD-30 Code:

    O-MBCY-W3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    METAL

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

2N5116 Frequently Asked Questions (FAQs)

  • The maximum safe operating temperature for the 2N5116 is 150°C, as specified in the datasheet. However, it's recommended to derate the power dissipation to ensure reliable operation.
  • While the 2N5116 can be used as a switch, its transition frequency (ft) is around 1.5 GHz, which may not be suitable for very high-frequency applications. You may need to consider a different transistor with a higher ft for high-frequency switching.
  • To ensure proper biasing for linear amplifier applications, you should follow the recommended biasing circuit and component values provided in the datasheet or application notes. Additionally, you may need to consider the device's thermal stability and provide adequate heat sinking.
  • For optimal performance and thermal management, it's recommended to follow good PCB layout practices, such as keeping the transistor away from heat sources, using a solid copper ground plane, and providing adequate thermal vias and heat sinks. Consult the datasheet or application notes for specific guidance.
  • Yes, the 2N5116 can be used in a push-pull amplifier configuration, but you'll need to ensure that the devices are properly matched and biased to minimize distortion and thermal issues. Consult the datasheet or application notes for specific guidance on push-pull amplifier design.

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2N5116 Overview

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