- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for 2N6667G
- Part Number 2N6667G
- Manufacturer onsemi
- Pin Count 3
- Part Category Transistor BJT PNP
- Package Category Transistor Outline, Vertical
- Footprint Name Transistor Outline, Vertical - TO−220 CASE 221A ISSUE AK
- Released Date Nov 3, 2015
- Last Modified Date Sep 19, 2024 2:45 PM UTC
- Pinout / Pin List Click Here (Member Only)
2N6667G Details
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Manufacturer Part Number:
2N6667G
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Brand Name:
onsemi
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Part Package Code:
TO-220 3 LEAD STANDARD
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Package Description:
LEAD FREE, CASE 221A-09, 3 PIN
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Pin Count:
3
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Manufacturer Package Code:
221A
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ECCN Code:
EAR99
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Factory Lead Time:
2 Days
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Manufacturer:
onsemi
2N6667G Frequently Asked Questions (FAQs)
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The maximum safe operating area (SOA) for the 2N6667G is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general rule, it's recommended to keep the device within the SOA to prevent thermal runaway and ensure reliable operation.
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To ensure the 2N6667G is properly biased for linear operation, you should ensure that the base-emitter voltage (VBE) is within the recommended range (typically around 0.6-0.7V) and that the collector-emitter voltage (VCE) is sufficient to maintain a linear operating region. You can use a voltage divider or a current source to set the base voltage and ensure stable operation.
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For optimal thermal performance, it's recommended to use a PCB layout that provides good thermal conduction and minimizes thermal resistance. This can be achieved by using a thermal pad or a heat sink, and ensuring good copper coverage around the device. Additionally, consider using thermal vias to dissipate heat more efficiently.
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To handle ESD protection for the 2N6667G, it's recommended to use ESD protection devices such as TVS diodes or ESD protection arrays in conjunction with the transistor. You should also follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.
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For optimal assembly and soldering, follow the recommended soldering temperature and time profiles specified in the datasheet. Use a solder with a melting point below 260°C to prevent damage to the device. Additionally, ensure that the device is properly cleaned and dried before assembly to prevent contamination and moisture damage.
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2N6667G Overview
Use the download button to access the 2N6667G schematic symbol, PCB footprint, and 3D model.
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