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2N7002KM-TP - MCC

Description: N-Channel 60 V 340mA 150mW Surface Mount SOT-723

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2N7002KM-TP - MCC PCB footprint - Other - Other - SOT-723_2023-4
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2N7002KM-TP - MCC  - 3D model - Other - SOT-723_2023-4
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2N7002KM-TP Details

  • Manufacturer Part Number:

    2N7002KM-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.34 A

  • Drain-source On Resistance-Max:

    4.5 Ω

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    10

2N7002KM-TP Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 2N7002KM-TP is -55°C to 150°C, although the datasheet only specifies a range of -40°C to 125°C for certain parameters.
  • To ensure proper biasing, make sure to provide a gate-source voltage (Vgs) between 2V and 4V, and a drain-source voltage (Vds) within the recommended range of 0V to 60V. Additionally, ensure the gate current (Ig) is within the specified range of ±100nA.
  • The maximum power dissipation for the 2N7002KM-TP is 1.4W, which is not explicitly stated in the datasheet. This value can be calculated based on the package thermal resistance and maximum junction temperature.
  • While the 2N7002KM-TP can be used as a switch, its frequency response is limited. The device has a relatively high input capacitance (Ciss) and output capacitance (Coss), which can affect its performance at high frequencies. It's recommended to evaluate the device's performance in your specific application and consider alternative devices if high-frequency switching is required.
  • The 2N7002KM-TP has a human body model (HBM) ESD rating of 2kV and a machine model (MM) ESD rating of 200V. To ensure ESD protection, follow proper handling and storage procedures, and consider adding external ESD protection devices or circuits in your design.

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